RF Design Magazine
Active downconverting RF mixer offers high linearity 
Apr 1, 2005 
Optimized to offer high linearity and wide dynamic range, Linear Technology's active downconverting RF mixer LT5527 brings a high level of integration...

Tightening the screws in RF power measurement 
Apr 1, 2005  By Carlos Calvo and Anthony Mazzei
Using a combination of a logarithmic amplifier and a temperature sensor it is possible to design a temperature compensation scheme to significantly reduce the contributions of the two major error factors in RF power management, temperature and process variations. In some cases, the temperature compensation hardware is integrated onto the power detector chip....

SI Intnl. adopts net-centric enterprise architecture 
Apr 1, 2005 
SI International Inc., an information technology and network solutions company, has developed and implemented an object-oriented (OO)/unified modeling...

Integrating devices above the traditional IC process 
Mar 1, 2005  Ashok Bindra, Editorial Director
Last month, in this column, I focused on CMOS and BiCMOS technology making strong inroads into the microwave territory and extending its reach right into...

Microwave Components 
Mar 1, 2005 
MMIC doubler Mimix Broadband Inc. has introduced a gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) differentially fed doubler with...

Direct digitization using superconducting data converters 
Mar 1, 2005  By Jack Rosa
Direct digitization is the ultimate enabler for future wireless communications. It refers to the ability to bring the digital domain as close to the antenna as possible, on both the receive and transmit ends of the radio transceiver system. It's a goal that remains just out of reach for systems based on traditional semiconductor technology and conventional data converters. Through the use of superconducting microelectronics technology and new, high-performing analogto-digital and digital-to-analog converters, however, direct digitization is firmly in reach....

Frequency divider design strategies 
Mar 1, 2005  By Louis Fan Fei
Typically, in frequency divider design, the trade offs are around the maximum operating frequency, power consumption, number of transistors needed and flexibility. Depending on the specific application the frequency divider is used, analog or digital approaches may be adopted. This paper will cover the fundamentals of both approaches....

Using behavioral models to drive RF design and verify system performance 
Mar 1, 2005  By Colin Warwick and Mike Mulligan
A new generation of software tools for model-based design is enabling the creation of system-level models that system architects can use to evaluate the RF design specification. These flexible design environments allow information to flow top down and bottom up. Before, during and after the circuitry for the components and modules is being designed, the same system-level model can incorporate ever more refined performance information in order to determine the impact on systemlevel performance....

TriQuint awarded DARPA contract to develop GaN high-power wideband module 
Mar 1, 2005 
TriQuint Semiconductor, a supplier of microwave and millimeter wave products for the defense industry, has been awarded a multiyear contract from the...

Log-amp performs advanced RF measurements 
Mar 1, 2005  By Ken Yang
The basic purpose of a logarithmic amplifier is to convert an RF input signal to an output voltage proportional to the log of RF power....

Digital voice technology improves microphone sound quality 
Mar 1, 2005 
Thanks to digital voice technology, electret condenser microphones (ECM) now come with built-in high-performance amplifiers for high-fidelity sound quality...

RF measurement system delivers semiconductor test solution 
Mar 1, 2005 
Employing innovations in RF measurements, Keithley Instruments' third-generation on-wafer RF option is designed for semiconductor parametric production...

Products 
Mar 1, 2005 
Active Components Surface-mount Schottky diodes M/A-COM has released the MA4E2200 series of zero bias detector (ZBD) silicon Schottky diodes for use in...

Digital oscilloscopes feature 100 GHz bandwidth 
Mar 1, 2005 
New sampling techniques permit LeCroy Corp.'s new digital oscilloscopes, WaveExpert 9000 and SDA 100G, to offer unprecedented 100 GHz bandwidth....

Why tiny sensors with single-chip wireless platforms are flourishing 
Mar 1, 2005  By Bar-Giora Goldberg
A miniature, integrated radio-sensor network in a cube less than 1-inch square is a technology whose time has come. It is essential to understand the special requirements imposed on RF devices operating on a tiny silicon die....

EDGE wireless solutions offer pervasive connectivity 
Mar 1, 2005 
Implementing MC75 quadband EDGE module from Siemens, AirLink Communications Inc., a provider of fixed and mobile wireless data solutions, unveiled its...

Tutorial on Gilbert mixers 
Mar 1, 2005  Barrie Gilbert
The recent article concerning active mixers (see Comparing active Gilbert mixers integrated in standard SiGe process Part I by N Rodriguez, E Hernandez...

Direct modulation radio hardware architectures for 3G communications systems 
Feb 1, 2005  By Patrick Naraine
The base station transceiver system is one of the most expensive network elements in the wireless network infrastructure and directly impacts the cost of the overall network design and deployment. The requirement for increased capacity and higher data rates will inevitably lead to increased cell deployments. To maintain costs at an acceptable level, telecommunications equipment manufacturers will continue to seek more cost-effective solutions to their infrastructure hardware....

Commercial-off-the-shelf MMIC components offer high reliability 
Feb 1, 2005  By Radha Krishna Setty, Kelvin Kiew and Harvey Kaylie
The life of semiconductor products is a function of junction temperature...

Products 
Feb 1, 2005 
Active Components Bipolar power transistors The PH1090-700B from M/A-Com is an NPN common base Class C pulse power transistor designed for IFF and other...

RF CMOS design kit creates on-chip spiral inductors 
Feb 1, 2005 
Semiconductor foundry service provider UMC and EDA software supplier Ansoft Corp. have developed a parameterized spiral inductor design kit based on full-wave...

CDMA2000 Design and Performance Requirements 
Feb 1, 2005  By Bill Schofield and Brad Brannon
Various heterodyne solutions have continued to flourish through incarnations of transceiver designs, each generation adding new control loops or components to improve the architectures. While communications standards such as CDMA2000 provide challenging performance requirements, the trends are for deep cost reduction, highly integrated solutions and flexibility....

Researchers demonstrate 25 Gbps data transmission over backplane connectors 
Feb 1, 2005 
Using novel duobinary signaling architecture and FCI's AirMax VS connector system, researchers at Lucent Technologies' Bell Labs have successfully demonstrated...

Analyzing sigma-delta ADCs in deep-submicron CMOS technologies 
Feb 1, 2005  By Yann Le Guillou
Sigma-delta analog-to-digital-converters are critical components in wireless transceivers. This study shows that a continuous-time, single-loop, single-bit SD ADC is suitable for wireless applications demanding less than 5 MHz conversion bandwidth. On the other hand, for applications that require bandwidth conversion higher than 5 MHz, the use of a CT single-loop, multibit SD ADC is recommended....

Wafer-scale integration brings low cost and a small footprint to active antenna arrays 
Feb 1, 2005  By Fred Mohamadi
Fabricating a 256-element steerable antenna array on an eight-inch wafer is quite a feat, given the multitude of issues—steering the antenna, optimizing the RF paths and the like. By addressing these and other matters, one at a time, it becomes clear that realization is well within reach....

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