To further enhance its 180 nm (or 0.18 micron) RF CMOS process with high-voltage capability for its foundry customers, IBM Microelectronics has inked a development agreement with austriamicrosystems AG. As a result, new process technology will blend IBM's 180 nm RF CMOS process with austriamicrosystems' 0.35 micron high-voltage CMOS to give designers 20 V and 50 V breakdown capabilities in 180 nm RF CMOS. According to IBM, due to the strict modularity with the base process, customers designing on the 180 nm CMOS process may use their existing design IP to allow a very fast time to market. Foundry customers for this process will have access to process design kits from IBM as well as austriamicrosystems, according to the partners.

While 20 V capability is aimed at portable applications, the 50 V process is being targeted at automotive as well as other high-voltage applications. Since the new process is flexible and extendable, other voltages are in the works. Also, according to the developers, because the process will allow more functions to be integrated on-chip, including passives and high Q inductors, it will enable a system-on-a-chip (SoC) solution. In fact, the aim is to include MEMS devices. Consequently, it will permit development of intelligent power management ICs for mobile devices, and low-cost integrated controllers for automotive, industrial and medical applications.

While limited availability of the new process is expected at the beginning of next year, production is scheduled to begin in 2009 at IBM's 200 mm facility in Essex Junction, Vt. And, the technology will be transferred to austriamicrosystems' facility at a later point in time.

“We recognize austriamicrosystems' experience in high-voltage technology, and our combined efforts will provide IBM and austriamicrosystems with an advanced process offering to benefit our customers. The timing is right — we are seeing an increasing demand in specialty processes for applications like power management, said Tom Reeves, vice president, semiconductor and technology services, IBM Global Engineering Solutions.”