Exploiting low-temperature co-fired ceramic (LTCC) technology, EPCOS has set another milestone in miniaturization of passive electronic components for the CDMA 850 mobile radio standard with the development of a power amplifier with integrated duplexer (PaiD). This LTCC module measures only 8.0 mm × 5.0 mm × 1.5 mm. Conventional solutions for CDMA 850 mobile handsets are based on discrete designs that require power amplifier (PA) modules, SAW duplexers, SAW filters and coupling capacitors. EPCOS has set the goal of integrating PAs and duplexers in LTCC modules, thus significantly reducing space requirements. Besides saving board space, users benefit from high cost efficiency combined with improved electrical properties. Thanks to the combination of indium gallium phosphide (InGaP) heterojunction bipolar transistor (HBT) PAs featuring outstanding temperature stability with SAW duplexers and filters this LTCC module has good electrical properties and makes significantly longer talk times possible, according to EPCOS. Samples are available. From mid-2005, PaiD modules will be offered for the PCS band as well.

For more information, visit www.epcos.com.