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 Products Apr 1, 2005 12:00 PM Amplifiers
RF power amplifier module
Xindium Technologies has introduced an RF power amplifier module for GSM and GPRS handsets in the industry's newest standard for PA module size. The PA module, the XIN9166, is a quad-band, 6 mm × 6 mm GSM/GPRS InGaP HBT device with integrated power control. The PA module provides 60% efficiency at maximum output power for GSM900, greater than 50% efficiency for DCS and ruggedness in excess of 10:1 VSWR across all bands. The module supports tri-band and quad-band applications using any combination of the GSM850, GSM900, DCS and PCS bands. The XIN9166 PA supports GPRS Class 12 operation. Sampling begins this summer. pHEMT amplifier module
Hittite Microwave Corporation has introduced four products within its connect-orized module product line. These 50 Ω wideband MMIC-based pHEMT amplifier modules are intended for military EW/ECM, space, test equipment, wideband telecom, microwave radio and industrial applications from 10 MHz to 20 GHz. The HMC-C001 wideband, low-noise amplifier module operates from 2 GHz to 20 GHz with 2.0 dB noise figure and +14 dBm output P1 dB. This LNA module delivers 15 dB gain and ±0.7 dB gain flatness from 2 GHz to 18 GHz, while consuming 65 mA from a single +12 V supply. The HMC-C002 wideband, low-noise amplifier module operates from 2 GHz to 20 GHz with 2.0 dB noise figure, 13 dB gain, and a gain flatness of ±1.0 dB. This LNA module also delivers +18 dBm output P1dB, while consuming 60 mA from a single +12V supply. The HMC-C003 wideband power amplifier module operates from 2 GHz to 20 GHz and delivers +26 dBm output P1dB and +30 dBm output IP3. This PA module also offers 15 dB gain and ±0.5 dB gain flatness from 2 GHz to 12 GHz, while consuming 310 mA from a single +12 V supply. The HMC-C004 wideband driver amplifier module operates from 10 MHz to 20 GHz and delivers +24 dBm Psat and 15 dB gain. This versatile driver amplifier module also offers 3.0 dB noise figure at midband and consumes only 195 mA from a single +12 V supply. GaAs HBT power amplifiers
RF Micro Devices Inc. has announced two gallium-arsenide heterojunction bipolar transistor (GaAs HBT) pre-driver power amplifiers (PAs) for cellular base station applications. The half-watt RF3807 and two-watt RF3809 single-stage devices operate across CDMA, GSM, DCS, PCS and UMTS frequencies. The RF3807 and RF3809 feature linearity greater than +42 dBm (UMTS), power-added efficiency greater than 40% (P1dB) and 450-2200 MHz performance, providing functionality for a variety of wireless applications. Operating in the UMTS frequency band, the RF3807 driver amplifier provides +28.5 dBm output power (OP1dB), high-power efficiency (40% at OP1dB), high linearity (+42 dBm OIP3) and gain (14.5 dB) under linear operation. The RF3807 obtains -60 dBc adjacent-channel power (ACPR) at power output (Pout) of +17 dBm. Operating in the UMTS frequency band, the RF3809 driver amplifier provides +33.5 dBm output power (OP1dB), high-power efficiency (43% at OP1dB), high linearity (+43 dBm OIP3) and gain (10.5 dB) under linear operation. The RF3809 obtains -60 dBc ACPR at Pout of +20 dBm. The RF3807 and RF3809 are currently being sampled to customers. The pre-driver amplifiers are priced at $4.07 in quantities of 10,000 units and will be available from RFMD in volume production during the second quarter of this year. GaAs MMIC power amplifier
Mimix Broadband Inc. has introduced a gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) three-stage balanced power amplifier and complementary three-stage driver amplifier. Both the balanced power amplifier and the driver amplifier use 0.15-micron gate length GaAs pseudomorphic high-electron mobility transistor (pHEMT) device model technology. The power amplifier has a balanced design to achieve good output match and covers the 43.5 GHz to 46.5 GHz frequency bands. It has a small signal gain of 13 dB with +29 dBm P1dB compression point. The driver amplifier covers this same frequency band and achieves a small signal gain of 13 dB with +24 dBm P1dB compression point. Used as a driver and final stage cascade, this chip set achieves +26 dB gain and 1 W output power. The balanced power amplifier and driver amplifier, identified as 44MPA0478 and 44MPA0470, respectively, are suitable for wireless communications applications such as millimeter-wave point-to-point radio, local multipoint distribution services (LMDS) and SATCOM applications. Analog and RF Front Ends
CDMA front-end module
Skyworks Solutions Inc. has introduced integrated RF transmit front-end modules (FEM) for CDMA, supporting cellular and PCS frequencies. Skyworks was first to introduce FEM solutions, offering a high degree of front-end integration for GSM/GPRS/EDGE handsets, and is expanding to address CDMA applications. The SKY77408 and SKY77409 combine the company's power amplifier (PA), filter, input/output matching, power detector and duplexer technology into a 5 mm × 8 mm laminate package. The SKY77408 and SKY77409 are matched, 22-pin surface-mount modules that meet the requirements of IS95/IS98 standards up to 25.5 dBm output power, and contain all the circuitry to maximize power detector performance. Integration of the RF front-end simplifies the design of the handset radio, as all critical matching between the filter, PA, power detection and duplexer is optimized within the module. The SKY77408 is designed for TX 824-849 MHz/RX 869-894 MHz frequencies, while the SKY77409 is designed for TX 1850-1910 MHz/RX 1930-1990 MHz frequencies. The modules are sampling now and will begin volume production in the third quarter of 2005. In quantities of 10,000, the SKY77408 is priced at $3, with the SKY77409 priced at $3.50. Broadcast, Satellite Communications
MPEG decoder
STMicroelectronics has announced an MPEG decoder for standard definition television in its OMEGA family of STB solutions — the STM5105. With its further integration of common functional blocks, including audio DACs and the VCXO, manufacturers using the new device will be able to cut their total component cost and simplify board design and assembly. The decoder supports all of the features of the STi5518 and adds new capabilities and higher performance. The clock speed of the embedded ST20 32-bit RISC CPU core — the dominant CPU in the STB market — is more than doubled to 200 MHz, providing increased power for advanced applications and enabling improved compatibility with mainstream set-top box middleware. Like other OMEGA devices, the decoder integrates a transport demultiplex block, the ST20 32-bit CPU, an audio/video MPEG-2 decoder, a digital video encoder and the enhanced display and graphics features. DVB descramblers in the transport demultiplex block and Macrovision copy protection allow it to be used in basic pay-TV services. The STM5105 is built using ST's 0.13-micron technology and uses the 216-pins LQFP package. Samples are available, with volume production expected early in the second quarter of this year. Pricing is $7 in 100k quantities. Consumer Electronics
RFID emulators
Texas Instruments is delivering Electronic Product Code Generation 2 tag emulators to five of the leading RFID reader and printer manufacturers. This effort helps to ensure EPC Gen 2 interoperability between TI transponders and readers and printers being manufactured based on the recently ratified, next-generation EPCglobal Inc ultrahigh-frequency (UHF) standard. The reader and printer manufacturers will use the TI emulators to simulate 96-bit code read/write, lock, as well as other functionality defined by the EPC Gen 2 protocol, to facilitate development of EPC Gen 2 products. Sample deliveries to customers start in the second quarter of this year and volume production in the third quarter. Integrated Bluetooth/GPS
RF Micro Devices Inc. has announced production shipments of the RF8900. The RF8900 is a Bluetooth/Global Positioning System (GPS) solution. The signal sensitivity of the RF8900 enables it to track GPS signals down to -155 dBm while maintaining a one second position update rate. High signal sensitivity allows the end user to locate its position virtually anywhere, including areas where GPS signals are weak, fading, or obstructed, such as light indoor environments and outdoor areas where there is foliage, tall buildings or mountains. A reference design includes all required software, filtering, memory, reference frequencies, and antennas for a complete Bluetooth/GPS system solution. Accessories enabled by the RF8900 provide GPS data (position, velocity, and time) to hand-held devices over a Bluetooth link. The solution is designed to interface with Bluetooth-enabled PDAs, cell phones, and personal computers. Embedded Technology
HW/SW co-verification tool
Adveda B.V. has announced support of Altera's Nios II soft-core embedded processor within Adveda's Univers multiprocessor-integrated development environment (IDE). The heart of the Univers tools is a software IDE with unique debug capabilities setup to support multiprocessor designs including its peripherals. The Univers ISS (instruction set simulator) model of the Nios II processor supports these debug features. Univers offers a unified verification solution, which enables simulation of embedded software in conjunction with hardware peripherals connected to the processors. You can use the RTL code of these hardware peripherals and the Univers RTL modeler will automatically create a fast simulation model that will run typically 10 to 100 times faster than an RTL simulator. Univers pricing starts at euro 1395. 802.11 embedded software
Universal Wireless Platform 2.0 from Device Scape is an embedded software platform for IEEE 802.11a/b/g wireless LAN (WLAN) designs. This embedded platform comes equipped with the 802.11a/b/g protocol stack along with support for the WPA2 and WMM specifications. It also comes with a Linux distribution and an Eclipse-based, graphical cross-development environment. Industrial Automation
RF modems
AeroComm Inc. has announced the ACE family of RF modems. ACE6490 and ACE6790 are housed in NEMA-4x enclosures, designed to withstand the rigors of extreme weather or other severe surroundings. Each product delivers variable output power up to 1 W at 900 MHz, maximizing range in the toughest environmental conditions. ACE products embed two distinct protocols to offer flexibility for rugged applications. ACE6790 uses dynamic peer-to-peer protocol for enabling mesh topology, while ACE6490 employs AeroComm's signature server/client networking architecture. Both products instill AeroComm's frequency hopping spread spectrum technology. All AeroComm 900 MHz transceivers use FHSS technology, employ data-encryption standards and support transmit-power levels of up to 1 W. ACE evaluation kits are available, featuring two transceivers, antennas, power supplies and cabling to assist customers in assessment. Microwave and Millimeter-Wave Technology
Connectorized prescalers
Hittite Microwave Corporation has introduced three wideband MMIC-based prescalers that are intended for military, space, wideband telecom, and microwave radio applications from 0.5 GHz to 18 GHz. The HMC-C005, HMC-C006 and HMC-C007 offer divide ratios of 2:1, 4:1 and 8:1, respectively. The input power may range from -15 dBm to +10 dBm at midband. They deliver -4 dBm of output power with an ultralow, additive single-sideband phase noise of -150 dBc/Hz. Each of these dividers operates from a single +5 V supply at 98 mA or less. The prescalers are housed in hermetically sealed enclosures with internally dc-blocked I/Os and field-replaceable SMA connectors. Downconverters for X and Ka frequency bands
Norsat International Inc.'s Microwave Business Unit has announced the availability of the industry's first commercially produced phase-locked loop, low-noise block down-converters (PLL LNBs) operating at X and Ka frequency bands. Both products are currently available for field trial, with full production expected to start in June. Next-Generation Wireless
I-Q modulators, demodulators
M/A-COM has extended its portfolio of surface-mount, I-Q modulators/demodulators designed for RFID, handset and base-station applications. The MA4IQP900L-1291T and the MA4IQP900H-1291T HMIC IQ modulator/demodulators, using low and high barrier silicon Schottky diodes, respectively, complement the current MA4IQP900M-1291T medium-barrier silicon device. These IQ devices also cover the same operating frequency range of 850 MHz to 960 MHz in a 6 mm2 MLP surface-mount package. For RFID applications, the low barrier MA4IQP900L-1291T replaces a discrete balun, quadrature, and Schottky diodes with a single, monolithic device. The device operates with an LO drive level of +10 dBm and has an input IP3 of 29 dBm. The devices are intended for GSM and CDMA handset and base station applications where LO drive levels (ranging from +10 dBm for the low-barrier device to +18 dBm for the high-barrier device) are required. Both are 50 Ω compatible and do not require additional impedance matching. The modulator function features third harmonic and fifth harmonic suppression of 45 dBc and 89 dBc for the low barrier, and 60 dBc and 99 dBc for the high barrier devices, which reduces the need for additional circuit filtering. The demodulators feature an amplitude imbalance of 0.2 dB and phase imbalance of 3.0°. Mobile station modem
QUALCOMM Inc. has announced the Mobile Station Modem (MSM) MSM6260 chipset and system software solution for WCDMA (UMTS)/HSDPA and GSM/GPRS/EDGE (EGPRS). The MSM6260 multimedia-platform chipset supports peak data rates of 3.6 Mbps to address global demand for high-speed wireless data devices. QUALCOMM's MSM6260 solution supports tri-band WCDMA/HSPDA (850/1900/2100 MHz) and quad-band EGPRS (850/900/1800/1900 MHz) with the RTR6275(TM)/RFR6275 configuration — a radioOne solution developed with RF CMOS (complementary metal oxide semiconductor), a low-cost, high-volume digital process technology. With RF CMOS process technology, QUALCOMM's MSM6260 solution drives down development and time to market costs. Samples of the MSM6260 chipset are expected to ship in the fourth quarter of this year. mWLAN platform
Texas Instruments Inc. has introduced the WiLink mobile wireless LAN (mWLAN) platform, which includes single-chip solutions to drive voice-over WLAN (VoWLAN) into mainstream mobile phones. The WiLink 4.0 mWLAN platform, TI's fourth generation mWLAN solution, consists of two options to meet a variety of marketplace needs. Manufacturers can choose between the TNETW1251 WiLink 4.0 802.11b/g single chip or the TNETW1253 WiLink 4.0 802.11a/b/g single chip, depending on their product requirements. The platform includes a robust software package, the WiLink 4.X software development kit (SDK) to deliver VoWLAN capabilities for mainstream mobile phones. The WiLink 4.0 TNETW1251 and TNETW1253 single chips include the MAC, baseband and RF transceiver functions in one 6 mm × 6 mm BGA package, which enables the most competitive board area design. Since the two chips are pin-for-pin compatible, TI provides OEMs with the flexibility to populate either 802.11a/b/g or 802.11b/g in the same board design, which allows manufacturing time adjustments to meet specific market demands or easy migration to 802.11a/b/g products from 802.11b/g designs. The WiLink 4.0 mobile WLAN 802.11b/g and 802/11a/b/g solutions are expected to sample in the third quarter. Products integrating TI's WiLink 4.0 platform are expected to be released to market in the second quarter of 2006. Semiconductor Technology
Datasheet c-BiCMOS process
PolarFab has published a new datasheet on its flexible Polar35 process, a 0.35-micron modular complementary BiCMOS (c-BiCMOS) process manufactured on 8-inch (200 mm) wafers. The data sheet describes Polar35's comprehensive device suites that allow customers to optimize analog and mixed-signal designs. The information details the BiCMOS, CMOS and bipolar device suites that incorporate an NPN bipolar transistor, a pair of complementary bipolar transistors, a full set of passive devices including a 3 kΩ/square poly resistor and a high density 2.25 fF/µm2 poly-poly capacitor, ESD protection devices and integrated silicon photodiodes with anti-reflective coating for 405 nm, 650 nm and 780 nm wavelengths. A representative cross-section of Polar35's integrated devices is included in the datasheet. Also listed are the design support options offered by PolarFab for its Polar35 process, which include 5 V digital cell libraries supporting schematic-based or SPR flows, a Cadence process design kit (PDK), scalable models and p-cells, a comprehensive design layout manual, and models (Spectre, PSpice and HSpice). Additionally, Polar35's key rule values, as well as available compatible mask layer and metal layer options, are presented in the datasheet. Gallium nitride (GaN)-on-insulator substrate
The Soitec Group has announced a process using its proprietary Smart Cut layer transfer and wafer-bonding technology. The company has generated a single-crystal, thin-film gallium nitride (GaN)-on-insulator substrate — representing a step forward in enabling the development of blue and white light-emitting diodes (LEDs), as well as for improving current and future device performance in RF and discrete power applications. Optoelectronics foundry
Avanex Corporation has begun offering foundry services to meet the need for custom optoelectronic components for data communications, telecommunications, medical, defense and instrumentation applications. Avanex also is introducing a set of standard optoelectronics chips with applications in those markets. Avanex's foundry services and optoelectronics chips are based on advanced indium phosphide (InP), gallium arsenide (GaAs) and lithium niobate (LiNbO3) technologies, all of which have been proven to meet stringent requirements of functionality and reliability in demanding telecommunications applications. In addition to foundry services, Avanex also is introducing a set of standard high-performance optical InP and GaAs chips suited for applications in telecommunications, data communications, medical, defense and instrumentation. Avanex offers Fabry-Perot (FP) and distributed feedback (DFB) laser chips, monolithically integrated electro-absorption modulator laser (EML) chips, pump laser chips and PIN, APD or monitoring photodiode chips. Sensing and Security
Single-chip security processor
Broadcom Corporation has introduced a single-chip security processor that ensures secure business transactions over the Internet. For such applications as online shopping, Broadcom's security processor ensures that the interaction between buyer and seller is not only secure, but that the information sent remains unchanged and reaches the destination for which it is intended. The BCM5825 security processor chip is a public key and cryptographic processor. It is capable of performing 12,000 RSA transactions per second, 9000 Internet key exchange negotiations per second, and 1 Gbps of bulk advanced encryption standard and IPsec, achieving a 250% performance increase over existing Broadcom security products. The BCM5825 offers users a complete system solution featuring application program interface support through Broadcom's software reference library for IPsec and SSL application software. The BCM5825 software design kit includes support for VxWorks, Linux and BSD operating systems. Signal Processing
Digital signal controllers
Texas Instruments Inc. is sampling the TMS320F2801, TMS320F2806 and TMS320F2808 digital signal controllers. Combining the real-time performance of TI's digital signal processors with the peripheral integration, C-language efficiency and ease of use of a microcontroller, the TMS320F28x devices are optimized for motor control, digital power conversion, and intelligent sensor control in industrial, appliance, automotive, medical and consumer applications. Test and Measurement
FPGA probe
Agilent Technologies Inc. has added probe setup automation to its field-programmable gate array (FPGA) dynamic probe application. The capability reduces the amount of time design engineers spend setting up logic analyzer measurements by up to 100 times when validating designs that incorporate Xilinx FPGA technology. Agilent's B4655A FPGA dynamic probe, introduced last March, interacts with an FPGA on-chip debug core to simplify and speed logic analyzer measurements. For the plug-and-run capability, the on-chip debug core produces a stimulus pattern on each of its output pins, one at a time. The logic analyzer looks for this unique pattern on its acquisition channels and when it finds the pattern, the instrument associates that input channel with the output pin on the core that produced the pattern. The logic analyzer then repeats the process for each of the remaining output pins to automatically determine how the logic analyzer is connected to signals in the FPGA. The FPGA dynamic probe application is compatible with the Agilent 16900 series logic analyzers, as well as the Agilent 1680 series stand-alone and Agilent 1690 series PC-hosted logic analyzers. The Agilent B4655A FPGA dynamic probe with plug-and-run capability is available for order and is expected to begin shipping later this month. The application is priced at $1500 for an annual license or $4500 for a perpetual license. Portable oscilloscopes
Agilent Technologies Inc. has introduced 12 portable digital storage and mixed-signal oscilloscopes (DSOs/MSOs) with bandwidths of 300 MHz, 500 MHz and 1 GHz. These oscilloscopes feature Agilent's patented MegaZoom III display technology. MegaZoom III provides real-time, high-resolution XGA waveform viewing with 256 levels of color-intensity grades and memory depth up to a full 8 Meg points. Customers can initially order a 2+16 or 4+16 channel MSO or a traditional DSO and upgrade to an MSO configuration later. The 6000 series oscilloscopes come standard with LAN, GP-IB and USB interfaces as well as an additional front-panel USB port to replace limited capacity floppy drives. Time and Frequency
HCMOS oscillator
Fox Electronics has introduced an HCMOS crystal oscillator. The new Fox oscillators operate at a frequency of 32.768 kHz. Key features of the new Fox465 oscillators include a 5 uA maximum input current, making them suitable for standby timing of ICs. They also operate at any voltage from 1.5 V to 6 V. The devices measure 4.0 mm × 6.5 mm × 2.0 mm. The Fox465 family has an operating temperature range of -40 °C to +85 °C. Frequency stability is +30/-150 PPM, and frequency tolerance at 25 °C is +30/0 PPM. Pricing for the Fox465 oscillator is $1.94 in quantities of 10,000. Samples are available now. Multi-octave tracking filter with YIG oscillator
Omniyig has introduced its model M141YTO, a tracking four-stage YIG filter with YIG oscillator. The YIG filter covers 2 GHz to 8 GHz with the YIG oscillator offsetting by 160 MHz above the filter. This unit is intended for use in electronic countermeasure receivers or in other receivers as a front-end tuner. The RF power output is +13 dBm minimum, and oscillator FM noise is -120 dBc, 100 kHz away. This unit can be integrated with an analog driver or a 12-bit digital driver to tune the full frequency range. Built to MIL-E-5400 specifications, the M141YTO operates over a temperature range of -54 °C to +85 °C. Its overall dimensions are 1.6 inches × 2.8 inches × 2.8 inches. With a 12-bit digital driver, the unit measures 1.65 inches × 3.7 inches × 3.4 inches. Omniyig offers other dual, two-stage bandpass tracking filters to cover various frequencies. Tx/Rx Technology
Single-chip FM tuner
STMicroelectronics has announced the availability of its model TDA7701 single-chip FM tuner for portable entertainment and computing equipment. The FM tuner operates from a low-voltage, low-current source: 2.4 Vdc to 3.2 Vdc at 12 mA. To conserve space, the chip comes in a 5mm × 5mm TFBGA40 chip-scale package having two rows of 300-micron diameter balls on 500-micron centers. In addition, the chip cuts the external component count by eschewing IF filters, ceramic capacitors and varicaps. These advantages are achieved by the chip's low-frequency 425 kHz IF stage, sporting built-in channel selection filters and a VCO (voltage-controlled oscillator) with built-in varicaps. The TDA7701 single-chip FM tuner sells for $2.50 each in quantities of 1000 and is available in production-volume quantities. An evaluation kit, including a hardware platform and software with API (application programming interface) functions and a friendly graphics user interface for demonstration, development and validation is also available. 802.11 transceiver
The AL7230 from Airoha is a single-chip 802.11a/b/g wireless LAN (WLAN) transceiver developed with a 0.35-micron SiGe BiCMOS process. This RF chip combines transmit and receive blocks with an on-chip power amplifier, voltage-controlled oscillator (VCO), and low-noise amplifier. Additionally, the transceiver supports 31 non-overlapping channels and is delivered in an 8 mm × 8 mm QFN package. L-band CRO-based VCO
Z-Communications has introduced the CRO3250A, an L-band VCO geared for the point-to-multipoint radio market. The CRO3250A uses a coaxial resonator, which increases the Q of the VCO, delivering low phase noise performance in a low-cost, compact package. Although optimized for narrowband operation, the CRO3250A covers a few megahertz of tuning bandwidth within only 0.5 Vdc to 4.5 Vdc of control voltage with an average tuning sensitivity of 13 MHz/V for easy integration with industry-standard PLL ICs. The VCO realizes a clean spectral signal of -113 dBc/Hz, typically, at 10 KHz from the carrier. The CRO3250A will strengthen any PLL with its 1.1:1 linearity over frequency and temperature and suppresses the second harmonic to better than -15 dBc. The VCO conserves energy by operating off a 5 Vdc supply while drawing only 19 mA and provides the end user 2 ± 2 dBm of output power. Furthermore, the CRO3250A is designed to operate over an industrial temperature range of -40 to 85 8C. It pushes less than 0.5 MHz/V with a 5% change in the supply voltage and pulls less than 0.5 MHz with a 14 dB return loss, any phase. Low-cost mixers offer LTCC reliability
Mini-Circuits has introduced MCA1, a series of broadband, highly reliable low temperature co-fired ceramic (LTCC) frequency mixers. With level 7, 10 and 13 (LO) models available for 300 MHz to 6 GHz designs, these double balanced mixers have insertion loss down to 6dB (typical, isolation up to 40 dB (typical), and are built with all circuitry hermetically embedded inside the ceramic to realize excellent temperature stability, repeatability, and compact 0.07-inch profile. They are ideal for the government's COTS program, as well as commercial applications. In quantities of 10, the pricing for each starts from $5.95. Search Terms
rf distribution amplifier power products rf distribution amplifier module mixers rf distribution amplifier low-noise technology rf distribution amplifier mpeg decoder rfid emulators rf distribution amplifier
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