To lower the cost of silicon RF transistors by almost 25 percent, Allentown, Penn.-based Agere Systems has packed five high-performance RF LDMOS transistors in lead-free overmolded plastic packages. Developed in cooperation with Amkor, the plastic-packaged transistors are capable of continuous operation at 200°C junction temperature. They are suitable for wireless base station amplifiers.

Agere announced its entry into this business last year. This year the company is announcing availability of low-cost plastic RF transistors. By comparison, ceramic is a more expensive material and has been the main substance for RF transistors for the last several years. Because of cost pressures, RF transistor suppliers are slowly transitioning to plastic.

A key feature of this package is that it uses a die attach with high thermal conductivity, according to Agere's analog group CTO Peter Gammel. In addition, the package offers lower thermal resistance between the transistor die and its heat sink. Thus, it improves reliability and requires less thermal derating.

The following Agere chips are being offered with overmolded plastic packaging: AGRA10, AGR09030, AGR09045, AGR09060 and AGRB10. The first four listed can be used across frequencies ranging up to 1 GHz. The AGRB10 can be used in frequencies spanning from 1 GHz to 2.7 GHz. These five new LDMOS devices range in power from 10 W to 60 W.

For more information, visit www.agere.com.