Avago Technologies has developed a novel chip scale packaging (CSP) technology that promises to enable SMT packages to reach the 100 GHz frequency range. Called WaferCap, it offers the same dimensions as an 0402 component and can reduce the amount of PCB space an RF device occupies by over 50%, according to the developer. Currently measuring 1.0 mm x 0.5 mm with a height of only 0.25 mm, WaferCap packaged parts reduce the thickness of any assembly significantly, said Avago. Plus, te elimination of wire bonds in the packaging process gives the device the flexibility and simplicity to fit in a variety of positions in a wide range of RF architectures, noted the supplier.

According to Avago, it’s new WaferCap CSP technology allows high frequency devices to be batch packaged cost effectively using standard semiconductor processing techniques. With WaferCap, the air cavity created under the “lid” and immediately above the circuit makes it possible to achieve higher frequency ranges, said the maker. The use of vias removes the need for costly and performance limiting bond wires, Avago said. Additionally, direct contact between the package substrate and the RF MMIC improves RF performance because it reduces the RF signal path and provides less resistance when compared to typical SMT designs. It also improves the heat transfer from the device to the assembly by removing the intervening package. The improved thermal condition and reduced number of bond wires greatly increase the reliability of the parts, stated Avago.

No special tooling is required as assembly is done with standard SMT techniques. The devices can be directly soldered onto a board using standard soldering techniques. Traditional mass production “pick and place” or chip shooter machines can easily place a WaferCap packaged device onto any RF architecture.

Products based on WaferCap CSP technology are available today. While recently announced miniature VMMK-12xx FETs are shipping now, the world smallest RF amplifiers, VMMK-2x03, are currently sampling and will be generally available in the fourth quarter, according to Avago.

www.avagotech.com