HyperBGA package from Endicott Interconnect Technologies is a PTFE-based coreless semiconductor package that enables silicon devices to run at extremely high speeds. The combination of low loss, low dielectric constant material and strip line cross sections enables signal speeds surpassing 12 Gbps. The material compliance of the PTFE, combined with the dimensional stability of a copper-invar-copper center plane, enables HyperBGA to provide long field life, with none of the BGA wear out, die cracking, delamination or flip chip bump fatigue of other packages.

According to Endicott, this solution, available as a single-chip module or SiP, offers the longest overall board level flip chip BGA life available, and it delivers 2-10x the flip-chip BGA package reliability of ceramic BGAs. HyperBGA is assembled using standard SMT processes and materials, making columns or land grid array sockets unnecessary. It is capable of flip-chip, SMT or CSP component attach on both sides.

HyperBGA provides full strip line structures, low coupled noise, low weight and very low power distribution inductance, and the compliant laminate minimizes die and BGA stress when using large die and large body sizes, the manufacturer said.