Speedline Technologies has introduced lead-free enhancements for its Electrovert Econopak Gold Wave Soldering Systems. The release of both the UltraFill Nozzles and a Quick Change Solder Pot enhance their lead-free capabilities.

Speedline's UltraFill Nozzles are 40% wider than traditional tin/lead nozzles. Their unique design and placement mean less superheat is required to reflow solder joints in the second wave. Other benefits include improved hole fill, bridge defect reduction and reduced dross formation. The nozzles are available in corrosion-resistant, stainless steel or titanium. An optional nitrogen shroud encompasses the UltraFill Nozzles in the pot-enabling air or nitrogen operation, and its lift design ensures ease of maintenance and de-drossing without the need for change or removal.

The Quick Change Solder Pot allows for the easy switch between two alloys such as tin/lead and lead-free solders. This results in a significant labor savings vs. a manual changeover. The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and trolleys. The lead-free ready Econopak Gold and lead-free upgrades are available immediately from Speedline distributors and representatives.

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