CPS Technologies, a company engaged in the design and production of metal matrix composites, now offers hermetic microelectronic packages. Made from materials such as Kovar, aluminum and steel, these hermetic microelectronic packages are intended for military, satellite and aerospace applications.

With more than 60 years of combined experience in hermetic microelectronic packaging, CPS Technologies' test and plating capabilities include electrolytic nickel per QQ-N-290 and ASTM B-689, electroless nickel per MIL-C-26074E and ASTM B-733, and gold per ASTM B-488 and MIL-G-45205C.

The CPS manufacturing facility in Norton, Ma. is certified to ISO:9001:2000. Providing quality assurance testing to MID-STD 883 and MIL-STD 202, CPS is compliant with DFARS clause 252.225-7014 ALT.1. CPS has supplied and assembled AlSiC (Aluminum Silicon Carbide) components for use in hermetic microelectronic packages since 1987.

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