Hypertronics has announced a new micro-miniature connector technology that is optimized for high reliability, military/aerospace applications. Based upon a contact system licensed from Ardent Concepts, the new HyperGrid technology features RC Springprobe contact technology—proven in rugged test-bed applications. The technology also employs solderless, compression style connections requiring only 20 grams of force per node to maintain connectivity, with a contact pitch as low as 0.4 mm, ideal for high density designs. In addition, the series exhibits excellent ac performance, with multi-GHz bandwidth, exceptional signal integrity and consistent dc resistance.

HyperGrid technology results in interconnect solutions that offer the same tiny form factor, high node count and stackability features required in many micro-miniature applications, without the electrical, repeatability or cost limitations associated with other technologies such as pogo pins, fuzz buttons, and conductive elastomers. The new, scalable HyperGrid technology will be available as custom interconnects for PCB-to-PCB, flex cable-to-PCB, and IC-to-PCB designs.

This new form factor opens portable, handheld, avionic and other space and weight constrained applications to the high reliability, repeatability and rugged designs of Hypertronics. The license agreement with Ardent Concepts is exclusive for military/aerospace applications enabling Hypertronics to provide specialized military/aerospace customers with unique interconnect solutions.

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