This standard set of testing requirements and associated acceptance criteria are crucial to users who want to ensure product reliability, as well as to suppliers, who can now proceed with one set of criteria to test and evaluate their finishes rather than trying to meet varying requirements from multiple customers.

JESD201, developed by the JEDEC JC-14.3 subcommittee on Silicon Device Reliability Qualification and Monitoring and the iNEMI Tin Whisker User Group, provides a uniform environmental acceptance testing and reporting methodology for tin whisker susceptibility of tin and tin alloy surface finishes employed in the electronics industry. It is intended to be used with JESD22-A121, "Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes" published in October 2005.

JP002 provides guidance in understanding the prevalent theories regarding tin whisker formation, the driving force behind tin whisker growth, and mitigation practices used to minimize whiskers. It serves as a source of background information for JESD22A121 and JESD 201.

"Although it is not possible to guarantee that whiskers will not grow under field conditions, the mitigation practices detailed in JP002, combined with the test and acceptance criteria outlined in JESD201, form the cornerstone of a three-fold strategy of mitigation practices, process controls and verification testing that helps to reduce the risks of tin whiskers," said Joe Smetana, principal engineer, advanced technology, for Alcatel and chair of the iNEMI Tin Whisker User Group. JESD201, JP002 and JESD22-A121 can be downloaded from the JEDEC web site.