MEMS design software supplier Coventor Inc and MEMS packaging solutions provider Kyocera have teamed up to provide software libraries for Micro-Electro-Mechanical Systems (MEMS) applications. The package libraries, developed jointly by the two partners will contain software models of a variety of MEMS compatible open tool hermetic ceramic packages, which are currently offered in Kyocera’s product portfolio. The package library design information will be made available at no charge to new and existing CoventorWare software customers.

The package library will initially target RF, inertial and infrared MEMS applications and will include elements such as package mask, process descriptions, material property data, and 3D detailed models. The libraries will initially enable users to couple MEMS devices and Kyocera standard packages for analysis of thermomechanical effects, low and high-frequency coupled RLC effects, as well as, failure modes and design for reliability in the future.

In addition, coupled device/package macro model extraction is supported for Cadence and Synopsys environments that will provide users with the ability to include package stress effects at the system level thereby creating more robust designs. The Standard package library contains models that include: SMD (surface mount device), S/B (side braze), PGA (pin grid array), C-DIP (Cerdip) and LCC (leadless chip carrier).

Due to the high cost of packaging, which can be as much as 80 percent of the overall cost of MEMS development, advanced packaging tools for MEMS devices are crucial to cost-effective development. The availability of open tool standard package models directly in the designers CAD environment will shorten design times significantly by enabling more rapid package selection, tighter integration with the package development group, and result in increased system robustness through MEMS package co-design and simulation. This will lead to reduced time-to-market, thus drastically reducing overall costs.

Kyocera packaging libraries will be available with CoventorWare software in third quartwer.

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