Tessera Technologies Inc., a developer, licenser and product development services provider for semiconductor chip-scale and multichip packages, has signed a new technology licensing agreement with Japan's Matsushita Electric Industrial Co., Ltd. (MEI), a consumer products companies and semiconductor device manufacturer. MEI, best known for its Panasonic brand, uses Tessera's chip scale packaging (CSP)technology in many semiconductor devices, including application-specific standard products (ASSPs), application-specific integrated circuits (ASICs) and various logic devices.

"Tessera is pleased to announce its new licensing agreement with Matsushita Electric, a distinguished electronics innovator for nearly a century," said Kirk Flatow, Tessera's senior vice president, marketing and sales. "Panasonic is well-known for high-quality leading-edge products. By leveraging Tessera's advanced packaging technologies, Panasonic has been able to deliver extremely small, reliable, and feature-rich consumer products to the market at low cost. We look forward to supporting Matsushita and to continuing to provide advanced packaging technologies that enable market leading innovations in future Panasonic products."

The technology available to MEI covers a broad range of CSPs and MCPs, including ICs packaged in "face-down," "face-up," "fold-over," "stacked," and "system-in-package" (SiP) formats, using many types of materials, including packages using either tape or laminate substrates. These package types are marketed by Tessera as MicroBGA for face-down orientations, MicroBGA-F for face-up orientations, and MicroZ for multichip solutions. Tessera's intellectual property is used in many forms of advanced packaging, covering an extensive range of materials and assembly processes.

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