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As products roll out, WiMAX gains momentum
Apr 21, 2005 5:40 PM  Ashok Bindra, Editorial Director

High-quality broadband WiMAX connectivity for worldwide interoperability for microwave access came a step closer to market as several chips and systems were unwrapped this week at the Broadband Wireless World in Las Vegas, Nev.

Fujitsu Microelectronics America, Inc. (FMA) revealed a highly integrated WiMAX system-on-a-chip (SoC) using its 0.18-micron CMOS process to enable deployment of broadband wireless access (BWA) equipment for both base stations and subscriber stations in licensed or license-exempt bands of 2 GHz to 11 GHz. Intel officially unveiled a single-chip modem and applications processor PRO/Wireless 5116 broadband interface, code-named Rosedale. Based on 0.13-micron process, the PRO/Wireless 5116 chip includes two ARM9 processors, one for the modem and one for applications processing. Texas Instruments expanded its broadband wireless access (BWA) portfolio with three RF chipsets, the TRF11xx chipset at 2.5 GHz, the TRF12xx chipset at 3.5 GHz and the TRF24xx chipset at 5.8 GHz. TI’s new chipsets are designed to support IEEE 802.16d/e standard RF front end for wireless base stations, access points as well as equipment backhaul, point-to-point microwave and public safety band applications. Consequently, TI chipsets are capable of supporting both emerging WiMAX and WiBro applications based on the IEEE 802.16 standard, as well as the more traditional fixed wireless access

FMA’s 802.16-2004-compliant SoC chip MB87M3400 is designed to facilitate the development of WiMAX-capable BWA systems. Toward that goal, FMA and SiGe Semiconductor, Inc. are jointly developing a complete reference design based on Fujitsu’s MB87M3400 and SE7351L/SE7051L RF transceiver chipset from SiGe Semiconductor. The reference design includes all of the software and hardware required to design residential and enterprise customer premise equipment. According to FMA, the reference design will be submitted to the WiMAX Forum for certification in the third quarter.

“As part of our commitment to standards development and compliance programs, Fujitsu Microelectronics and SiGe Semiconductor are working closely together to provide OEMs with the most effective mix of technologies for high-performance WiMAX-compliant equipment,” said Keith Horn, senior vice president of sales and marketing for FMA. “The combination of our WiMAX–compliant SoC and SiGe’s leading-edge RF devices provides manufacturers with an easy route to achieving the integration and performance required for next-generation broadband wireless systems.”

One of the early adopters of Fujitsu’s WiMAX SoC is Aperto Networks. Using the engineering samples of MB87M3400, SoC emulation platform and reference design, Aperto has developed WiMAX-compliant base station and subscriber units.

“The accelerated availability of the SoC is critical for our milestones, and multiple carrier field trials have been planned with our WiMAX systems using the Fujitsu chip,” said Aperto CEO Reza Ahy. The two partners have made progress on pre-certification testing of all system functionalities and are well on-track for the WiMAX Forum July 2005 early-stage Plugfest and tests at the WiMAX Forum certification lab CETECOM in Barcelona, Spain, noted Ahy.

Another systems developer to partner with FMA is Wi-LAN Inc. Wi-LAN demonstrated its next-generation Libra MX network system using the Fujitsu WiMAX SoC MB87M3400. According to the Wi-LAN, its Libra MX system is the industry’s first WiMAX platform that meets the performance and throughput requirements of demanding point-to-point and point-to-multipoint broadband applications. In fact, Fujitsu and Wi-LAN have been working closely on WiMAX technology since late 2002. Wi-LAN has combined its system expertise and orthogonal frequency division multiplexing (OFDM) technology with FMA’s chip design capabilities in a development program that created the new SoC from Fujitsu. The highly integrated, high-performance solution incorporates embedded processors and mixed-signal technology in a device that will enable systems developers like Wi-LAN to provide cost-effective WiMAX Forum-certified equipment, said Wi-LAN.

According to WiMax Forum, its CETECOM interoperability testing lab will be testing products for WiMAX Forum certification in July this year.


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