As Patti points out the problem today is that as we push toward smaller geometries we are inadvertently build things that look like parallel capacitors. A copper wire is typically three to four times higher than it is wide. If you are building in 100-nanometer technology, the wires are going to be 300 to 400 nanometers high. So the distributed capacitance is enormous.

As is true in digital applications, 3D interconnection is also a solution in RF applications since it dramatically shortens wires. It thereby compensates for the deterioration of transmission qualities that would otherwise occur with wire lengths in a non-3D scenario. Patti expands on why cell phones will make the move to 3D interconnect:

"I think that RF circuitry in cell phones—which is a high-volume, low-cost industry—will want to see 3D interconnect mature for a year and one-half in digital applications. But because it will become clear to cell phone manufacturers that reduction in costs will occur for them—actually an increase in yield, in their case—it will add up to a compelling argument for them to make the switch."

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