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Industry team readies gallium nitride RF semiconductor technology for new defense frontiers
Apr 26, 2005 3:53 PM 

The Defense Advanced Research Projects Agency (DARPA) has awarded a team, led by Raytheon, as prime contractor, and Cree, as subcontractor, the task of developing next-generation, gallium-nitride (GaN) semiconductors for military and commercial products. The program will focus on introducing GaN into military and commercial programs, beginning in 2006.

The products will include blue and green light-emitting diodes (LEDs), power switching devices, and radio frequency (RF) and microwave devices. Applications for these products will include solid-state illumination, power switching, wireless infrastructure and optical storage.

The three-year, $26.9 million Cree-Raytheon program has a potential value of $59.4 million if all program options are exercised. Of this amount, the program award contemplates that $11 million will be subcontracted to Cree for the three-year effort, and $24.5 million in total, if all of the options are exercised.

Cree began developing GaN-on-silicon carbide (SiC) RF devices in 1996. The semiconductor work for this program will be conducted at the Raytheon RF components foundry in Andover, Mass. and the Cree Wide-Bandgap MMIC foundry in Durham, North Carolina—as well as the Cree Santa Barbara Technology Center in Goleta, Calif.


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