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0.13 micron platform tools analog and RF systems on chip
Oct 12, 2005 2:16 PM 

Jazz Semiconductor, an independent semiconductor wafer foundry, has introduced CA13, a process design kit for its 0.13-micron RFCMOS process. The kit enables a designer to team low-power, digital logic with high-performance analog and RF circuitry. Introduced at the Fabless Semiconductor Association (FSA) Conference in Santa Clara, Calif. the week of Oct. 3; the CA13 is a low-cost alternative for applications that do not require the expensive copper interconnects of traditional 0.13-micron CMOS implementations for the back-end.

The CA13 platform is the company's third generation of modular process technology and is well suited for any design requiring RF or analog system on chip (SoC) integration—including integrated demodulators and cellular and wireless LAN transceivers with digital power control integration.

With its CA13 platform, Jazz enables the integration of key analog and RF functions by using an aluminum metal interconnect scheme to deliver the same RF performance and low-power consumption of conventional 0.13-micron technology while maintaining the lower cost and reduced complexity of an aluminum-based approach. The Jazz platform is further differentiated by the addition of a triple well for RF isolation, 5.6 fF/um2 MIM capacitors, varactors, low- and high-value precision resistors and thick metal inductors for improved RF and analog performance.

Rollout of the CA13 platform precedes the release of the Jazz SBC13 silicon-germanium BiCMOS technology that will be based upon the RFCMOS process. The SBC13 technology will include a low-cost, four-mask, SiGe-bipolar NPN combining all of the features of CA13 with the performance advantages of SiGe at low additional complexity. Design kits for SBC13 will be available in the first quarter of 2006.


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