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High-frequency package chosen for device life testing
Jan 11, 2006 12:53 PM 

StratEdge has announced that one of its DC to 23 GHz low cost commercial package has been adopted by Accel-RF as a platform for life testing of high-frequency devices. Accel-RF, based in San Diego, Calif., makes fully integrated, automated systems that characterize RF and DC performance degradation to predict device life expectancy. In addition to the package, StratEdge provides microelectronic assembly services to Accel-RF, including gold-tin eutectic die attachment and wire bonding.

During life testing, devices are subjected to temperatures of up to 250°C while operating at high frequencies. The devices need to be mounted in the test equipment. Since Accel-RF equipment is used to test devices of many configurations from different manufacturers, it is essential that the package used be flexible enough to accommodate a wide variety of sizes.

The StratEdge 580286 LCC package has a 0.250 inch x 0.250 inch (6.35 mm x 6.35 mm) cavity dimension that will accommodate most devices that need testing. It features a flexible pin-out of two RF leads and eight DC leads for easy connection of the device to the package. The package combines a copper composite base with a patented microstrip-imbedded microstrip-microstrip transition design. This composite metal base provides thermal conductivity and expansion compatible with compound semiconductor devices.


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