AMKOR and IMEC to jointly develop 3D wafer-level packaging
Jul 26, 2007
Amkor Technology and IMEC of Europe have entered into a two-year collaboration agreement to develop cost-effective, 3D-integration technology based on wafer-level processing techniques. ...
Microvision, Motorola to develop mobile-device pico projectors
Jul 26, 2007
Microvision and Motorola have agreed to develop pico-projector display solutions for mobile applications, leveraging Microvision's PicoP ultra-miniature laser-based display. ...
TI’s wireless infrastructure DSPs capture China’s 3G market
Jul 19, 2007
By Ashok Bindra, Editorial Director Latest 3G news from China indicates that Texas Instruments digital signal processors (DSPs) are gaining ground in this market. ...
CSR, Freescale ink wireless connectivity partnership
Jul 19, 2007
UK’s CSR and Freescale Semiconductor will work in partnership to bring wireless connectivity to a number of Freescale's mobile and home consumer reference designs and development kits....
Telco’s FTTH poses a threat to cable operators
Jul 19, 2007
To become multiple service operators, offering television programming like cable providers do, telecom companies are rapidly deploying all fiber or deep-fiber access technology....
Air conditioner anti-theft alarm uses custom sensor
Jul 12, 2007
By Mark Valentine, Technical Editor, RF Design Combating the rapid increase in the theft of air conditioner units for the precious metals they contain, a low-cost device from AC Watchdog protects A/Cs through multiple alarm options triggered by tampering. ...
Teardown reveals Apple’s iPhone components
Jul 12, 2007
Teardown analysis by iSuppli of Apple’s iPhone reveals Infineon Technologies, National Semiconductor and Balda provide key components in the device, along with established vendors such as Samsung Electronics. ...
Diagnostic software provides aerial view of VoWLAN traffic
Jul 12, 2007
By Mark Valentine, Technical Editor, RF Design Using AirMagnet's VoFi Analyzer PRO 3.0, IT managers have unprecedented visibility to all phases of voice traffic in Voice-Over-Wireless LAN systems, greatly simplifying both deployment and troubleshooting. ...
Stand-alone fingerprint module makes biometrics affordable
Jul 5, 2007
By Ashok Bindra, Editorial Director After nearly three years of code development, and protected by several pending patents, ODI Security, LLC has readied a low cost, power efficient stand-alone embedded fingerprint module for consumer and commercial applications. ...
Nujira expands operations in Pacific Rim
Jul 5, 2007
Envelope tracking technology developer Nujira has announced plans for the expansion of its operations in Japan and China. ...
CMOS enables high-speed A/V connectivity using 60 GHz band
Jul 5, 2007
Fabless start-up SiBEAM has announced the development of working 60 GHz chipsets for non-line-of-sight applications, built using standard CMOS manufacturing techniques. ...
Metalink’s 802.11n chipset obtains Wi-Fi Alliance certification
Jul 5, 2007
After successfully passing the Wi-Fi Alliance’s qualification tests for compliance with IEEE 802.11n draft 2.0 specifications, Metalink Ltd. has announced that its WLANPlus chipset has received the Wi-Fi certified 802.11n draft 2.0 certification by the Wi-Fi Alliance. ...
Rohde & Schwarz Canada gets a new president
Jul 5, 2007
Test and measurement equipment supplier Rohde & Schwarz has appointed a new president for its Canada arm. Jack Cowper, who is currently vice president of the company, has been promoted to president of Rohde & Schwarz Canada Inc. ...
WiMAX chipsets enable emerging capabilities and applications
Jun 28, 2007
By Mark Valentine, Technical Editor, RF Design Upcoming generations of WiMAX chipsets from NextWave will provide advanced platforms on which to develop next-generation WiMAX mobile-terminal and infrastructure products. ...
Single-chip technology advances parallel processing
Jun 28, 2007
A prototype of what may be the next-generation of personal computers has been developed by researchers in the University of Maryland's A. James Clark School of Engineering. ...
Integrated ZigBee solutions ease entry
Jun 21, 2007
By Ashok Bindra, Editorial Director The rising popularity of ZigBee based sensor networks has prompted proponents to offer a variety of products for this burgeoning market. While Texas Instruments Inc. has released an unparalleled system-on-chip solution for low-power ZigBee/IEEE 802.15.4 wireless sensor networking, Sheffield UK’s Jennic Ltd has readied a ZigBee starter kit for under $200 for those with little or no RF design or software development experience. ...
Bluetooth goes ultra-low power
Jun 21, 2007
To take Bluetooth technology to a new low in power consumption, the Bluetooth Special Interest Group has announced that it will integrate Nokia developed ultralow-power wireless technology Wibree. ...
Qualcomm, Siano ink FLO chip deal
Jun 21, 2007
Qualcomm Inc. and Siano Mobile Silicon have signed a royalty-free agreement that enables Siano to use Qualcomm’s patented technologies to design, manufacture and sell certain semiconductor chip products that implement FLO technology. ...
