RF Design News Archive | RF News, Design News

Software radio solutions provider taps experts from Nokia’s research center
Jun 18, 2008
SDR solutions provider mimoOn GmbH has announced the addition of key wireless and software engineers from Nokia’s research center...

Supplier gets sales support in Israel
Jun 18, 2008
Anadigics, Inc. has selected MTI Engineering, Ltd., as its manufacturer’s representative for Israel...

Unified multi-region digital radio receiver addresses diverse standards
Jun 18, 2008
Frontier Silicon is planning to release a unified digital radio receiver module to work with all existing band 3 and L-band digital radio standards for Europe and Asia...

Richardson, HVVi Semi ink global distribution agreement
Jun 12, 2008
Richardson Electronics, Ltd.has signed a global distribution agreement to distribute HVVi Semiconductors, Inc. RF power transistors...

Agilent extends reach to low-cost test and measurement market
Jun 12, 2008
Agilent Technologies Inc.has acquired substantially all of the assets of Taiwan-based Escort Instruments Corp., an established supplier of low-cost test and measurement instruments...

Latest Microwave Office design environment offers significant enhancements
Jun 12, 2008
The AWR 2008 Microwave Office design environment includes more than 100 enhancements and sweeping changes to the user interface...

Cree unwraps commercial GaN MMIC amplifiers
Jun 12, 2008
Using its gallium nitride (GaN) RF transistors, Cree, Inc. has introduced commercially available GaN monolithic microwave integrated circuit (MMIC) amplifiers...

Highly integrated wireless chip combines Bluetooth, GPS and FM functionalities
Jun 5, 2008
CSR has unwrapped its seventh generation BlueCore silicon, the BlueCore7...

GPS module integrates antenna
Jun 5, 2008
Cambridge, UK based Antenova Ltd. has become a SiRF certified developer and value-added manufacturer (VAM)...

IMEC, AIXTRON demonstrate GaN growth on 200 mm Si wafers
Jun 5, 2008
Belgium’s microelectronics research center IMEC and Germany’s metal-organic chemical-vapor deposition (MOCVD) equipment developer AIXTRON have jointly demonstrated the growth of high-quality and uniform AlGaN/GaN heterostructures on 200 mm silicon wafers...

Advanced 3D simulation tool aids design of antenna systems
Jun 5, 2008
Laird Technologies, Inc. has deployed advanced 3D simulation tool as an aid in the design of complex electronic devices, including advanced antenna systems...

TriQuint completes acquisition of WJ Communications
May 29, 2008
Stockholders have approved the merger agreement of TriQuint Semiconductor and WJ Communications, Inc....

OFDM based PLC modem delivers up to 100 kbps
May 29, 2008
Maxim Integrated Products OFDM-based, powerline communications (PLC) modem delivers cost-effective, two-way data communication over AC and DC powerlines at speeds up to 100 kbps...

Laird and employees aid China’s earthquake victims
May 29, 2008
Laird Technologies, Inc. announces corporate donation of $100,000 for Chengdu, China relief efforts in response to earthquake...

GSMA, Femto Forum team boost in-building coverage
May 29, 2008
GSMA and the Femto Forum join to further expedite the definition and deployment of femtocells within mobile operator networks...

LXI Consortium expands into China
May 22, 2008
The LXI Consortium has accepted RIGOL Technologies as the first member from Mainland China...

GaN power transistor maker expands design team
May 22, 2008
Gallium nitride on silicon (GaN-on-Si) RF power transistor manufacturer Nitronex continues to expand its design engineering team...

Test gear suppliers join EGPS Forum
May 22, 2008
Agilent Technologies and Spirent Communications joined the CSR and Motorola EGPS Forum to foster development of EGSP technologies...

Turbo technology speeds analog and mixed-signal verification
May 15, 2008
Cadence Design Systems, Inc. has implemented advanced "turbo" technologies within the Virtuoso Spectre circuit simulator...

New division focuses on integrated microwave assembles
May 15, 2008
Z-Communications, Inc. has created a new division named Z-Comm Microwave based in San Jose, Calif. ...

Digital antenna supplier secures $34 million in second round funding
May 15, 2008
Ubidyne has secured $34 million in second round funding lead by Doughty Hanson Technology Ventures...

Seventh generation LDMOS raises the efficiency bar
May 15, 2008
NXP Semiconductors will display the first product using seventh generation (Gen7) LDMOS technology...

Chip scale packaging technology breaks new ground in RF performance
May 15, 2008
Avago Technologies has developed a novel chip scale packaging (CSP) technology that enables SMT packages to reach the 100 GHz frequency range...

Hittite redesigns web site
May 8, 2008

BeO attains new benchmark in thermal conductivity
May 8, 2008
Beryllium oxide (BeO) supplier Brush Ceramic Products Inc. has significantly improved thermal conductivity of the insulating material BeO...

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