SiC MESFETs power new UHF amplifiers
Aug 30, 2007
UK’s EMC amplifier supplier MILMEGA is using its silicon carbide based MESFETs to provide the RF power in MILMEGA’s new line of UHF power amplifiers....
Tiny digital radio suits MAV payloads
Aug 23, 2007
By Mark Valentine, Technical Editor, RF Design FreeWave’s MM2 900 digital data radio provides a high-bandwidth link in a form factor that is well suited for use in micro-aerial vehicles and other unmanned aerospace applications. ...
Touch-screen technology enhances FAA security
Aug 23, 2007
Northrop Grumman has delivered TouchTable technology to the Federal Aviation Administration that will help the FAA to quickly mitigate and respond to cyber security threats to the FAA network. ...
TI acquires low power RF design company
Aug 16, 2007
By Ashok Bindra, Editorial Director To expand its low power RF portfolio, Texas Instruments has acquired Integrated Circuit Designs, Inc., a privately-held company that specializes in the design of radio-frequency ICs. ...
System runs validated RF test for EV-DO revision A based mobile devices
Aug 16, 2007
Spirent Communications plc, a global provider of performance analysis and service management solutions, has readied a test platform, labeled C2K-ATS platform, to run validated RF test cases for EV-DO Revision A technology based mobile devices....
Aeroflex opens regional service center in Singapore
Aug 16, 2007
To enable its test solutions division to provide instrument service support to its customers within the major growth markets in Asia, Aeroflex has opened a new regional service center in Singapore. ...
3G Evolution
Aug 9, 2007
3G Evolution by Erik Dahlman, Stefan Parkvall, Johan Skold, and Per Beming is a resource for mobile and wireless engineers, network operators and planners, and network managers....
Satellite system achieves maturity milestone
Aug 9, 2007
Working with the U.S. Air Force and independent agencies, TEAM TSAT, led by Boeing, has demonstrated that its Transformational Satellite Communications System Space Segment hardware and software can function in simulated operational environments, achieving Technology Readiness Level-6 for payload, antenna, information assurance and gateway technologies....
OFDMA developer granted eight international patents
Aug 9, 2007
ADAPTIX, developer of orthogonal frequency division multiple access technology, has been granted eight patents by the governing patent agencies in Japan, Australia, Hong Kong and South Korea. ...
Single CMOS chip supports dual Wireless-USB roles
Aug 9, 2007
By Mark Valentine, Technical Editor, RF Design Primarily developed to reduce costs for OEMs, Wisair’s WSR601 is a production-ready, single-chip solution fabricated with digital CMOS process technology for both host and device wireless-USB applications. ...
FCC revises 700 MHz band service rules
Aug 2, 2007
By Ashok Bindra, Editorial Director To advance the creation of a nationwide interoperable broadband network for public safety, Federal Communications Commission has revised the 700 MHz band plan and service rules. ...
SiRF, Intel ink GPS deal
Aug 2, 2007
Aiming to bring location and wireless connectivity to mainstream mobile devices, San Jose, Calif.-based SiRF Technology Inc. has inked a license and joint development agreement with Intel Corp. ...
Data compression software enhances mobile platform performance
Jul 26, 2007
By Mark Valentine, Technical Editor, RF Design Developed to enhance the hardware performance of smart mobile devices, Smith Micro Software’s StuffIt Wireless Windows Mobile Edition is a compression utility for all Smart Phones and PDA's powered by Windows Mobile 5.0 or 6.0. ...
AMKOR and IMEC to jointly develop 3D wafer-level packaging
Jul 26, 2007
Amkor Technology and IMEC of Europe have entered into a two-year collaboration agreement to develop cost-effective, 3D-integration technology based on wafer-level processing techniques. ...
Microvision, Motorola to develop mobile-device pico projectors
Jul 26, 2007
Microvision and Motorola have agreed to develop pico-projector display solutions for mobile applications, leveraging Microvision's PicoP ultra-miniature laser-based display. ...
TI’s wireless infrastructure DSPs capture China’s 3G market
Jul 19, 2007
By Ashok Bindra, Editorial Director Latest 3G news from China indicates that Texas Instruments digital signal processors (DSPs) are gaining ground in this market. ...
CSR, Freescale ink wireless connectivity partnership
Jul 19, 2007
UK’s CSR and Freescale Semiconductor will work in partnership to bring wireless connectivity to a number of Freescale's mobile and home consumer reference designs and development kits....
