Ziptronix has unveiled details on its patented Direct Bond Interconnect (DBI®) technology for low-cost, reliable, and repeatable wafer-to-wafer or chip-to-wafer bonds without the need for high-temperature compression techniques. The patented technology aims to make three-dimensional (3D) integration widespread. According to Ziptronix Chief Executive Officer (CEO) Dan Donabedian, "While several different bonding schemes have been developed, through silicon vias (TSVs) are clearly going to be part of any large-scale 3D IC process; and the advantages of metal-to-metal bonding technologies have been well-established." He added that "what Ziptronix provides is the final part of the equation - a high throughput, low temperature oxide bond technology that achieves a metal connection without requiring a low throughput, high temperature thermal compression." The Ziptronix technology is available for license to original-equipment manufacturers (OEMs).

Ziptronix (www.ziptronix.com)