Air cavity package developer Quantum Leap Packaging, Inc. (QLP) has developed the industry's first hermetic plastic package that meets JEDEC standards. Called HermeTech, this plastic air cavity QFN maintains hermetic leak rates of less than 5x10^-8 atm cc/s He, and passes full Mil spec reliability tests, said the developer.

Through a combination of its unique Quantech material technology, and innovative UltraSeal ultrasonic lid process, QLP has developed HermeTech plastic hermetic QFNs that feature tailorable properties, low moisture permeability and high temperature stability that enable true hermetic performance.

"We are pleased to offer HermeTech, the industry’s first plastic hermetic package which combines the hermetic performance and reliability of ceramic packages with the design flexibility and tailored material properties of Quantech to solve longstanding packaging problems." said David Grooms, CEO of Quantum Leap Packaging. "I see QLP's breakthrough technology leading the next generation of semiconductor packaging."

Tailored for advanced packaging applications such as image sensors, HB-LEDs, MEMs, LDMOS and microwave devices, HermeTech QFNs provide packaging solutions to critical needs such as low stress packaging and improved thermal performance, said QLP.

Hermetic levels have never been achieved with organic materials. Traditional plastic packages such as epoxy transfer mold fail because of poor moisture absorption and other material issues such as stress and non-linear properties. Similarly, standard plastic air cavity packages have exposed leak paths at the lead frame-polymer interface and poor lid seal methods that fail to achieve hermetic performance, said the manufacturer.

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