|
|||||||||||||||||||
|
|
Alliance Semiconductor releases low-voltage/low-power EMI reduction chip in a TSOT-23 package Dec 11, 2003 12:00 PM Santa Clara, Calif. -- Alliance Semiconductor Corporation yesterday announced the availability of its ASM3P2779 low-voltage, low-power, Electromagnetic Interference (EMI) reduction integrated circuit (IC) for next-generation portable devices. This IC is a low-power, versatile spread-spectrum frequency modulator specifically designed for the mobile market and targets PDAs, cell phones, portable MP3 players, notebooks, as well as video and imaging applications. The ASM3P2779 is the first general purpose EMI reduction IC to be offered in a 6-pin TSOT-23 (1.0 mm maximum height). Operating at 2.5 V or 3.3 V and covering a frequency range of 15-30 MHz, the ASM3P2779A draws less than 4mA at 30MHz with a 20pF load, and a mere 8uA in standby mode. The ASM3P2779's very small footprint addresses the need to maximize the usage of PCB real estate and integrates easily into designs, while substantially reducing EMI across all harmonics, and reducing system cost and product weight by eliminating the shielding and by decreasing the number of circuit board layers that are traditionally required to pass FCC EMI regulations.
Alliance's ASM3P2779 is currently available, and pricing is at $1.50/chip in
volumes of 1,000. The chip measures 3 mm maximum from pin-to-pin, 3 mm maximum
from end-to-end, and 1 mm high. Custom frequency programming is available on a
case-by-case basis. Datasheets and additional information are available upon
request.
|
|
|||||||
| Back to Top |