Greensboro, N.C. — RF Micro Devices, Inc., has begun high-volume production shipments of its RF3163 CDMA power amplifier (PA) module to a top-two CDMA handset original equipment manufacturer (OEM) headquartered in Korea.

The RF3163 is a high-performance GaAs HBT CDMA power amplifier module with a 3 mm x 3 mm x 0.9 mm package. The RF3163 design is based on RFMD's Lead Frame Module (LFM) packaging technology that reduces component count, product size and total cost. RFMD expects to increase sales of its CDMA PAs in calendar 2004 to this customer and to other leading manufacturers of CDMA handsets.

The RF3163 PA module is designed for US Cellular CDMA IS-95, 1xRTT and 1xEV-DO operation. RFMD's LFM packaging technology eliminates surface-mount devices and the associated costs of surface-mount device placement by integrating the functionality of passive components into the gallium arsenide (GaAs) die manufactured by RFMD. Products designed using LFM technology do not require laminate or LTCC substrates or surface mount components, which simplifies the production supply chain and decreases manufacturing lead time.

The RF3163 offers best-in-class ruggedness, thermal dissipation, moisture sensitivity level (MSL), electrostatic discharge (ESD) sensitivity and an industry-leading profile of only 0.9 mm. At +28 dBm, the RF3163 provides an efficiency of 41 percent and linearity of -51 dBc for the high handset talk time and minimum system distortion.

For more information, visit www.rfmd.com.

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