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Optical lithography drives cost efficiency for millimeter-wave products
Feb 1, 2008 12:00 PM 

Gallium arsenide (GaAs) foundry service provider TriQuint Semiconductor, Inc. has unveiled TQP13-N, its latest high performance process technology for designing and manufacturing cost-effective, millimeter wave products for the commercial marketplace. Designed using TriQuint's patented transistor technology, which replaces traditional E-beam with optical gate lithography, TQP13-N offers dramatic cost savings over current millimeter wave technologies, said the supplier.

Historically, millimeter wave applications, which operate in frequencies up to 95 GHz, have been limited to military and other low volume products due to high cost. The introduction of TriQuint's TQP13-N process can broaden the market for these applications by offering manufacturers a cost-effective solution for high volume millimeter-wave products.

According to market research firm Gartner, Inc, the global penetration rate for ACC is just one percent today. However, by 2015, the market research firm expects more than half of all new cars will be fitted with ACC or some variant. As per Frost & Sullivan's program manager Sandeep Kar, “Over 40 percent of all minivans, full-size SUVs, and luxury SUVs manufactured in the last two years featured Rear Seat Entertainment systems or LCD screens, providing a broad customer base capable of integrating aftermarket mobile satellite television systems.”

Mike Peters, director of marketing for TriQuint's commercial foundry stated “High frequency applications have been considered too expensive for use in commercial markets. With TQP13-N, TriQuint is offering a disruptive new technology at a price point that can drive the volume needed to be successful.

TQP13-N technology is enabled by a unique, low-cost 150 mm GaAs wafer manufacturing process. It incorporates a highly repeatable optically defined 0.13 µm self-aligned gate pHEMT FET using a highly reliable refractory gate metal system, coupled with high density capacitors, epitaxial and nichrome resistors, and two layers of gold interconnect ( see Table). The use of optically defined gates greatly reduces the cost of production relative to similar processes based on E-beam gate lithography, said TriQuint.

TriQuint said that the process is in production and device samples and design kits are available.

For more information, visit www.tqs.com.

Processs summary and specifications
Component Parameter Nominal Value Units
D-Mode pHEMT Vp (1µA/µm) -0.3 V
Idss 100 mA/mm
Gm (max) 750 mS/mm
Breakdown, Vds 8 V
Ft @ 250mA/mm 95 GHz
Fmax 200 GHz
Imax (Vgs=0.7 V) 550 mA/mm
NF (12 GHz) < 0.5 dB
Gate Length 0.13 µm
Interconnect 2 Metal Layers
MIM Caps Value 340 pF/mm2
Resistors NiCr 50 Ohms/sq
Epi 100 Ohms/sq
Backside Vias Yes
Mask Layers No Backside Vias 13
With Backside Vias 15


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