Scheduled to begin rolling out in early 2004, the new cost-effective, silicon-efficient modules will include a small GSM RF front end, and a high-performance module for dual-band, multimode 802.11a/b/g WLAN systems. The roadmap also includes chip-scale solutions for 802.11b/g WLAN systems, quad-band CDMA handsets, and dual-mode GSM/WCDMA and GSM/CDMA2000 handsets. The front-end modules will integrate all of the RF circuitry required between the transceiver and the antenna, including the power amplifiers, power detectors, filters, switches, matching and bias components.

SiGe's strategy addresses the growing market for power amplifier modules, which is expanding as a result of the significant advantages modules bring to equipment manufacturers. A single chip-scale module can replace up to 70 components in a typical wireless front-end. The plug-n-play capability simplifies design, reduces bill of materials for lower cost and board area, and speeds time-to-market. This allows manufacturers to easily meet the shorter time-to-market windows for emerging 2.5G and 3G cellular handsets, and portable Wi-Fi devices.