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Process integrates RF MEMS with control and logic on CMOS chip Oct 25, 2007 12:29 PM
By incorporating RF MEMS into CMOS process flow, WiSpry has readied a family of MEMS-tunable digital capacitors for antenna tuning, band programmable impedance matching, power amplifier tuning and tunable RF filters. These products integrate low-power CMOS control and voltage generation logic with an array of tunable RF-MEMS digital capacitors to offer an ultra linear, digitally programmable, variable capacitance solution on a single silicon die. “We have led the way in development of RF-MEMS into a fabless CMOS flow, enabling the scale and yield required for competitive cost structures in high volume markets such as cellular handsets. The tunable digital capacitor (TDC) is the building block component for the multiple custom and standard RF product families we will introduce over the coming months,” said Russ Garcia, president and CEO of WiSpry. The tunable RF-MEM digital capacitors are fabricated on standard 200 mm CMOS wafers. In addition, the manufacturer has also developed techniques for wafer level encapsulation of RF-MEMS devices. Samples of the new digitally tunable capacitors will be available in second quarter of 2008.
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