The Advanced Circuit Materials Division (ACMD) of Rogers Corp. is planning to exhibit its RO3000 and RO4000 high-frequency laminate materials and other advanced materials at the upcoming Taiwan Printed Circuit Assembly (TPCA) show at the Nangang Exhibition Hall in Taipei, Taiwan on October 22-24. These lead-free, RoHS-compliant laminates offer the outstanding performance of PTFE-based materials with the ease of fabrication common to FR-4 (epoxy/glass) laminates. Widely used for power amplifiers, these circuit materials feature excellent electrical and mechanical stability with temperature.

The firm will also be showing its COOLSPAN ™ and HEATWAVE ™ thermal management materials in Taiwan. HEATWAVE ™ thermal management solutions are aluminum silicon carbide (AlSiC) Metal Matrix Composite (MMC) materials that combine light weight with excellent thermal conductivity. COOLSPAN ™ Thermal Interface Material (TIM) is an easily dispensed grease with minimal fillers and extremely reliable performance.

Rogers Corp.
(www.rogerscorp.com)